Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Manufacturing Engineering, or a related field.
· 3+ years of hands-on SMT process engineering experience in a manufacturing environment.
· Automotive industry experience is mandatory (understanding of IATF 16949, PPAP, APQP, and MSA).
· Preferably Active IPC Certification (e.g., IPC-A-610 CIS/CIT, IPC J-STD-001 CIS/CIT, or IPC-7711/7721).
· Expertise in Solder Paste Printing (stencil design, squeegee pressure, paste rheology).
· Expertise in Pick-and-Place programming and maintenance (e.g., Fuji, Panasonic, Yamaha, Juki, ASM).
· Expertise in Reflow Oven Profiling (thermocouple attachment, Soak/Spike profiles).
· Expertise in AOI programming and optimization (e.g., Koh Young, Omron, CyberOptics, Mirtec).
· Strong statistical analysis skills (SPC, DOE, Gage R&R).
Experience with Selective Soldering, Wave Soldering, or Conformal Coating.
· Familiarity with MES (Manufacturing Execution Systems) and Industry 4.0 concepts.
· Lean Six Sigma Green Belt or Black Belt certification.
· Experience with Underfill or Staking processes for automotive ruggedization.